Committee Members

General Chair
Yang Chai
HK PolyU

General Co-chair
Tim Cheng
HKUST

TPC Chair
Mansun Chan
HKUST

TPC Co-chair
Yansong Yang
HKUST
Steering Committee

Chair
Shuji Ikeda
TEI Solutions

Bin Zhao
CTI

Arokia Nathan
Darwin College
Cambridge University

Ravi Todi
Synopsys

Murty Polavarapu
BAE

Roger Booth
Qualcomm

Samar Saha
Prospicient Devices

Albert Wang
UC Riverside

Kazunari Ishimaru
Rapidus

Yogesh Chauhan
IIT Kanpur
Advisory Committee

Hiroshi Iwai
International College of Semiconductor Technology,
National Yang Ming Chiao
Tung University (NYCU), Taiwan

Cor Claeys
Department of Electrical Engineering, KU Leuven, 3001
Leuven, Belgium

Cary Yang
Santa Clara University

Reza Arghavani
Sandia National Laboratories
Executive Committee

Yang Chai
HK PolyU

Roger Booth
Qualcomm

Mansun Chan
HKUST

Yansong Yang
HKUST

Qiming Shao
HKUST

Merlyne De Souza
U Sheffield

Pei-Wen Li
NCTU

Can Li
HKU

Masumi Saito
Kioxia

Zhongrui Wang
SUSTech

Meiki Ieong
Simbury

Carmen Fung
HKSTP

Man Hoi Wong
HKUST

Roger Booth
Qualcomm

Huaqiang Wu
Tsinghua

Rino Choi
Inha U.

Bernard Lim
Appscard

Shinichi Yoshida
SONY

Bill Nehrer
Atomera

Bich-Yen Nguyen
SOITEC

Benjamin Iniguez
URV

Edmundo Gutierrez
INAOE

Ming Yang
HK PolyU
Technical Sub-committees
1. Materials
Track Chair

Lance Li – HKU
Track Co-chair

Hyeon Suk Shin
Track/ Sub Committee Members
- Hyeon-Jin Shin – GIST
- Tony S. P. Feng – CityU
- Arindam Ghosh – IIS
- Jing-Kai Huang – CityU
- Kah-Wee ANG – NUS
- Quentin Smets – IMEC
2. Process, Tools, Yield, and Manufacturing
Track Chair

Xiao Gong
NUS
Track Co-chair

Anabela Veloso
IMEC
Track/ Sub Committee Members
- Kai Ni – University of Notre Dame
- King-jien Chui – Samsung Electronics
- Rinus Lee – Tokyo Electron
- Michael Givens – ASM
- Michael Givens – Qualcomm
- Tomasz Brozek – PDF Solutions
- Xiaoping Shi – NAURA Microelectronic
- Hock Chun Chin – NXP
3. Advanced Semiconductor (Logic) Devices
Track Chair

Yimao Cai
Peking University
Track Co-chair

Yuda Zhao
Zhejiang University
Track/ Sub Committee Members
- Naoto Horiguchi – IMEC
- Gauri Karve – IMEC
- Weihai Bu – STIC
- Jiezhi Chen – Shandong University
- Yunlong Li – Zhejiang University
- Diing Shenp Ang – Nanyang Technological University
- Woo Young Choi – Seoul National University
- Masaharu Kobayashi – University of Tokyo
- Zongwei Wang – Peking University
- Chunsong Zhao – Huawei Technologies
- Rakshith Saligram – University of Tennessee, USA
4. Memory Technologies
Track Chair

Can Li
HKU, HK
Track Co-chair

Xinyu Bao
TSMC, US
Track/ Sub Committee Members
- Toshihiko Miyashita – Micron, Japan
- Peng Huang – PKU, China
- Hao Jiang – Fudan, China
- Giacomo Pedretti – HPE, US
- Albert Liao – Micron, US
- Fen Xue – Stanford, US
- Matteo Farronato – Politecnico Milano, Italy
- Yi Ning Chen – Zhejiang University, China
- Jiangbin Wu – CAS, China
- Kyeongran Yoo – SK Hynix, US
5. Photonics, Imaging and Display
Track Chair

Weida Hu
SITP, China
Track Co-chair

Deep Jeewarla
Upenn, US
Track/ Sub Committee Members
- Zhipei Sun – Aalto University, Finland
- Johnny C Ho – CityU, China
- Tae-Woo Lee – Seoul National University, Korea
- Lan Fu – Australia National University
- Jinshui Miao – SITP, China
- Paul Zhou – Fudan University
- Sanjay Behura – San Diego State University
- Yu Jung Lu – Academia Sinica
- Yang Xu – Zhejiang University
6. Wide-Bandgap Power and RF Devices
Track Chair

Man Hoi Wong
HKUST
Track Co-chair

Wai Tung Ng
University of Toronto, Canada
Track/ Sub Committee Members
- Yu Cao – Qorvo, USA
- Daniel Dryden – Air Force Research Laboratory, USA
- Xiaohang Li – KAUST, Saudi Arabia
- Yang Liu – Sun Yat-sen University, China
- Uttam Singisetti – University at Buffalo, USA
- Chang-Soo Suh – TI, USA
- Weifeng Sun – Southeast University, China
- Marko Tadjer – Naval Research Laboratory, USA
- Kornelius Tetzner – Ferdinand-Braun-Institut, Germany
- Jin Wei – Peking University, China
- Yuhao Zhang – Virginia Tech, USA
- Zheyang Zheng – USTC, China
7. Modelling and Simulation
Track Chair

Ming Yang
Track Co-chair

Lan Wei
Track/ Sub Committee Members
- Sagnik Dey – Texas Instruments, USA
- Yao Li – Keysight, USA
- Plamen Asenov – Synopsys, UK
- Lixin Ge
- Darsen Lu – National Cheng Kung University
- Saeroonter Oh – Sungkyunkwan University
- Mansun Chan – HKUST
- Yanguang Zhou – HKUST
- Panpan Zhang – Beijing University of Posts and Telecommunications
- Songlin Li – Nanjing University
- Lining Zhang – Beijing University
- Wladek Grabinski – GMC consulting, Switzerland; MOS-AK, EU
- Elena Gnani – University of Bologna
- Volker Kubrak – Infineon, Germany
- Fei Liu – Peking University
8. Reliability and Testing
Track Chair

Mario Lanza
National University of Singapore, Singapore
Track Co-chair

Fei Hui
Zhengzhou University, China
Track/ Sub Committee Members
- Kah-Wee Ang – National University of Singapore, Singapore
- Andrea Padovani – University of Modena and Reggio Emilia, Italy
- Marco A. Villena – University of Granada, Spain
- Fernando Aguirre – Intrinsic Semiconductor, United Kingdom
- Sebastian Pazos – King Abdullah University of Science and Technology, Saudi Arabia
- Nagarajan Raghavan – Singapore University of Technology and Design, Singapore
- Stanislav Tyaginov – Imec, Belgium
- Kranthi Nagothu – Texas Instruments, USA
9. Packaging and Heterogenous Integration
Track Chair

Xin Ou
SIMIT
Track Co-chair

Nelson Fan Chun Ho
ASMPT
Track/ Sub Committee Members
- Ringo Tse Wing Ho – ASMPT
- Tanja Braun – Fraunhofer IZM
- Wei-Chung Lo – ITRI
- Jihong Choi – Qualcomm
- Tiangui You – SIMIT
- Prof. Genquan Han – Xidian University
- Prof. Jianjun Zhang – Institute of Physics, Chinese Academy of Sciences
- Prof. Xinyu Liu – Institute of Microelectronics of The Chinese Academy of Sciences
- Prof. Xiuyin Zhang – South China University of Technology
10. Sensor, MEMS, Bio-Electronics
Track Chair

Zhiqin Chu
Track Co-chair

Ming-Huang Li
Track/ Sub Committee Members
- David Tsai – The University of New South Wales
- Igor Aharonovich – University of Technology Sydney
- Sanghyeon Kim – Korea Advanced Institute of Science and Technology (KAIST)
- Chih-Ting Lin – NTU, Taiwan
- Yipeng Lu – Peking U
- Chengjie Zuo – USTC
- Yao Zhu – A-Star
- Ming He – Peking U
- Lang Zeng – Beihang U
- Xiaoling Wei – Shanghai Institute of Microsystem and Information Technology
- Meiyong Liao – National Institute for Materials Science, Japan
- Tae-il Kim – Sungkyunkwan University
- Jens Anders – University of Stuttgart
11. Flexible and Wearable Electronics
Track Chair

Xinge Yu
City University of Hong Kong
Track Co-chair

Min Zhang
The Chinese University of Hong Kong, Shenzhen
Track/ Sub Committee Members
- Sean M. Garner – Corning Incorporated
- Tae-Woo Lee – Seoul National University
- Youfan Hu – Peking University
- Chen Jiang – Tsinghua University
- Wei Lan – Lanzhou Univeristy
- Xinwei Wang – Peking University Shenzhen Graduate School
- Jinghua Li – Ohio State University
- Wubin Bai – University of North Carolina at Chapel Hill
- Hang Zhou – Peking University Shenzhen Graduate School
12. Nanotechnologies
Track Chair

Saptarshi Das
Pennsylvania State University
Track Co-chair

He Tian
Tsinghua University, China
Track/ Sub Committee Members
- Yury Illarionov – SUSTECH, China
- Huamin Li – Suny Buffalo, USA
- Vita Po-Ho Hu – National Taiwan University, Taiwan
- Sayani Majumdar – Tampere University, Finland
- Nazek Elatab – KAUST, Saudi Arabia
- Prasana Sahoo – IIT KGP, India
- Kibum Kang – KAIST, South Korea
- Daixuan Wu – Xi’an Jiaotong University,China
- Zegao Wang – Sichuan University,China
- Songang Peng – Institute of Microelectronics, Chinese Academy of Sciences
- Zheng Zhang – University of science and technology beijing, China
- Zhongmin Wei – Institute of Semiconductors, Chinese Academy of Sciences
- Zhongmin Wei – Institute of Semiconductors, Chinese Academy of Sciences Peking University, China
- Kaihui Liu – Peking University, China
- Xing Wu – East China Normal University, China
13. Disruptive Technologies (Metaverse, Neuromorphic Computing, Quantum Computing)
Track Chair

Han Wang
Track Co-chair

Yuchao Yang
Track/ Sub Committee Members
- Yuqi Su – Peking University Shenzhen Graduate School
- Hongjie Liu – Reexen Technology
- Gina Adam – George Washington University (pending confirmation)
- Xinxin Wang – Stanford
- Lei Ye – Huazhong University of Science and Technology
- Zhihao Yu – Nanjing University of Posts and Telecommunications
- Xu Zhang – Carnegie Mellon University
14. Industrial Applications
Track Chair

Carmen Fung
HKSTP
Track Co-chair

Meikei Ieong
Simbury Ltd